Residual Stress Evolution by the ex-situ Annealing of TiN Thin Films Deposited on Steel Substrates
| Autor: | Luc Segers, Jean-Luc Delplancke, De Bruyn, René Winand, Min Ye, Guy Berton, Marie-Paule Delplancke |
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| Rok vydání: | 1998 |
| Předmět: |
Materials science
Annealing (metallurgy) Mechanical Engineering Mineralogy chemistry.chemical_element engineering.material Condensed Matter Physics Titanium nitride chemistry.chemical_compound chemistry Mechanics of Materials Residual stress Physical vapor deposition Tool steel engineering General Materials Science Thin film Composite material Tin High-speed steel |
| Zdroj: | Materials Science Forum. :275-282 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.287-288.275 |
| Popis: | TiN thin films were deposited on high speed steel substrates by a PVD method at substrate temperatures of 450 °C (film A) and 200 °C (film B). Structural properties of the films were studied by X-Ray diffraction and atomic force microscopy. Residual stresses in the films are determined by a X-Ray diffraction method. It is found that film A has an average residual stress of about 8 GPa and a rougher surface. Film B has a smoother surface and a larger residual stress (12 GPa). By annealing at a temperature of 450 °C for four hours, the residual stress in film B is reduced to the same level as that in film A. The mechanisms which affect the residual stress of TiN films will be discussed. |
| Databáze: | OpenAIRE |
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