Structural, electrical, and thermal features of polyimide composites filled with semiconductive MXene sheets
| Autor: | Dong-Li Zhang, Zhi-Min Dang, Jia-Yao Pei, Qi-Kun Feng, Lu Weiwei, Qi Dong, Chang Liu, Shao-Long Zhong |
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| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
chemistry.chemical_classification Materials science Physics and Astronomy (miscellaneous) Composite number 02 engineering and technology Polymer Dielectric 021001 nanoscience & nanotechnology 01 natural sciences Thermal conductivity Film capacitor chemistry 0103 physical sciences Thermal Dielectric loss Composite material 0210 nano-technology Polyimide |
| Zdroj: | Applied Physics Letters. 118:262901 |
| ISSN: | 1077-3118 0003-6951 |
| Popis: | Polymer-based dielectrics are widely applied in the fields of electronics and electrical power systems due to the high breakdown strength, excellent flexibility, and unique self-healing capability. However, the low stored energy density and unsatisfactory heat management of polymer dielectrics hinder the development of polymer-based film capacitors. In this research, artificial composites with improved capacitive energy storage and thermal conductivity are fabricated by blending the two-dimensional semiconductive MXene sheets with a polyimide (PI) matrix. Remarkably, a PI based composite with 1 wt. % MXene sheets increases its dielectric permittivity from ≈3.27 to ≈3.53 and enhances its discharged energy density from ≈1.93 to ≈2.38 J/cm3 while maintaining its low dielectric loss of 80%. Meanwhile, a high in-plane thermal conductivity of 0.418 W m−1 K−1 is achieved for PI/MXene composites with 5 wt. % MXene. In addition, the distribution of temperature field inside the composites has been investigated by a finite element method. These results represent a strategy in polymer dielectrics to achieve simultaneous high energy density and thermal conductivity, which may also have potential for applications in high temperature environments. |
| Databáze: | OpenAIRE |
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