Projecting interconnect electromigration lifetime for arbitrary current waveforms
| Autor: | Nathan W. Cheung, B.K. Liew, Chenming Hu |
|---|---|
| Rok vydání: | 1990 |
| Předmět: |
Materials science
business.industry Direct current Electrical engineering chemistry.chemical_element Electromigration Electronic Optical and Magnetic Materials law.invention Stress (mechanics) chemistry law Waveform Electrical and Electronic Engineering Atomic physics business Alternating current Electrical conductor Current density Helium |
| Zdroj: | IEEE Transactions on Electron Devices. 37:1343-1351 |
| ISSN: | 0018-9383 |
| Popis: | A vacancy-relaxation model is proposed. It predicts the DC lifetime, pulse DC (arbitrary unidirectional waveform) lifetime, pure AC lifetime, and AC-plus-DC-bias lifetime for all waveforms and all frequencies above 1 kHz. The predictions are verified by experiments and significantly raise the projected lifetimes beyond the widely assumed A/sub dc/ T/J/sub rms//sup m/. The pure AC lifetimes of aluminum interconnect are experimentally found to be more than 10/sup 3/ times larger than DC lifetime for the same current density. In addition, AC stress lifetimes are observed to follow the same dependences on current magnitude and temperature, for T > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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