Cu deposition using a permanent magnet electron cyclotron resonance microwave plasma source
| Autor: | R. L. Rhoades, S. M. Gorbatkin, Lee A. Berry |
|---|---|
| Rok vydání: | 1994 |
| Předmět: |
Materials science
Electromagnet business.industry Metals and Alloys Analytical chemistry Cyclotron resonance Surfaces and Interfaces Electron cyclotron resonance Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Sputtering law Magnet Materials Chemistry Optoelectronics Deposition (phase transition) Thin film business Microwave |
| Zdroj: | Thin Solid Films. 253:382-385 |
| ISSN: | 0040-6090 |
| DOI: | 10.1016/0040-6090(94)90352-2 |
| Popis: | An electron cyclotron resonance (ECR) plasma has been used in conjunction with a solid metal sputter target for Cu deposition over 200-mm diameters. The goal is to develop a deposition process suitable for filling submicron, high aspect ratio features used for ultralarge scale integration. The system uses a permanent magnet for creation of the magnetic field necessary for ECR and is significantly more compact than systems equipped with electromagnets. A custom launcher design allows remote microwave injection with the microwave entrance window shielded from the Cu flux. Cu deposition rates up to 100 nm/min were observed and film resistivities were typically in the low to mid 2 {mu}ohm-cm range. Based on deposition rate measurements at two radial sample position, uniformities of a few % over 200-mm diameters should be attainable. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|