(Invited) Evaluation of 2' Power-Grade GaN Substrates Produced By the Near Equilibrium Ammonothermal (NEAT) Method

Autor: Daryl Key, Michael Dudley, Yafei Liu, Benjamin Jordan, Eric Shang, Balaji Raghothamachar, Edward Letts, Tadao Hashimoto
Rok vydání: 2020
Předmět:
Zdroj: ECS Meeting Abstracts. :1805-1805
ISSN: 2151-2043
Popis: This paper provides evaluation of 2" GaN substrates produced by the near equilibrium ammonothermal (NEAT) method. Ammonothermal growth is a proven method of producing low-dislocation GaN crystals with practical productivity. [1, 2] By choosing a near-equilibrium growth condition, consistent growth with maintained crystal quality has been achieved. [3] Several tens of bulk GaN crystals were grown simultaneously, yielding many 2" GaN substrates in one growth batch. Figure 1 is an example of bulk GaN crystals after shaping and Figure 2 is an example of 2" GaN wafer. We have developed an X-ray mapping technique which presents the distribution of full width half maximums (FWHMs) of rocking curves from 002 and 201 diffractions over a 2" wafer. The X-ray mapping revealed superior microstructure quality of NEAT GaN substrates. NEAT GaN substrates typically show an average full width half maximum (FWHM) of the 002 X-ray rocking curve of 30 arcsec or better, as shown in Figure 3. The X-ray mapping data were compared with other characterization techniques, including X-ray topography. X-ray topography confirmed that a dislocation density of typical NEAT GaN substrate was about 2 x 105 cm-2. Wide area X-ray topography also revealed flatter lattice of a NEAT GaN substrate compared with a GaN substrate fabricated by hydride vapor phase epitaxy (HVPE). Additionally, recent progress in oxygen reduction yielded NEAT GaN substrates with reduced residual donors, coloration and optical absorption. The oxygen concentration was about 2 x 1018 cm-2. An absorption coefficient of 1.3 cm-1 was obtained at 450 nm. The usability of NEAT GaN substrates was also confirmed through device fabrication. Multiple collaborators successfully fabricated high-power diodes with breakdown voltage over 1000V. References [1] E. Letts, Y. Sun, D. Key, B. Jordan, and T. Hashimoto, J. Cryst. Growth 501 (2018) 13. [2] R. Dwilinski, R. Doradzinski, J. Garczynski, L. Sierzputowski, R. Kucharski, M. Zajac, M. Rudzinski, R. Kudrawiec, W. Strupinski, and J. Misiewicz, Phys. Stat. Sol. A 208 (2011) 1489. [3] T. Hashimoto, E.R. Letts, D. Key, and B. Jordan, Jpn. J. Appl. Phys 58 (2019) SC1005. Acknowledgement This work was supported by U.S. Department of Energy (DOE), Advanced Research Program Agency, Energy (ARPA-E), SWITCHES program (grant number DE-AR0000445), US DOE ARPA-E OPEN 2018 programs (DE-AR0001008 and DE-AR0001008), U.S. DOE, the Office of Energy Efficiency and Renewable Energy (EERE) under the Advanced Manufacturing Office (AMO), Small Business Innovation Research (SBIR) program (grant number DE-SC0013791), US DOE EERE AMO FY18/FY19 Lab Call (grant number DE-LC-000L059), and the Office of Naval Research (grant number N00014-19-1-2069). Figure 1
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