Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
| Autor: | Eddy Blansaer, Riet Labie, Ralph Lauwaert, Daniel Werkhoven, Davy Pissoort, Daniel Vanderstraeten, Jonas Lannoo, Bart Vandevelde |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Materials science 020208 electrical & electronic engineering Alloy Solder paste 02 engineering and technology Temperature cycling Bending engineering.material 01 natural sciences Stress (mechanics) Reliability (semiconductor) Soldering 0103 physical sciences 0202 electrical engineering electronic engineering information engineering engineering Quad Flat No-leads package Composite material |
| Zdroj: | 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
| Popis: | In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting temperature SnBi based alloy LMPA-Q. The outcome of the study is to evaluate if these new SnBi based solder material perform similar, worse or better than the more standard lead-free solders. |
| Databáze: | OpenAIRE |
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