| Autor: |
Miao Cai, Yun Chao Chen, Daoguo Yang, Hong Liang Jia |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 15th International Conference on Electronic Packaging Technology. |
| DOI: |
10.1109/icept.2014.6922760 |
| Popis: |
The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry can achieve a soldered bonding to LED chips. The flexible layers of polyethylene terephthalate (PET)-copper foil are formed by two approaches-hot lamination and transfer molding. The thickness of PET-copper foil is an important parameter to the thermal design. A finite model is developed to study the effects of heat dissipation at different thickness of PET-copper foils. The results show that the flexible have a good thermal property with the thickness of PET-copper foil from 450um to 650um. Finally, a flexible model is simulated at temperature distribution with 5× 5 LEDs. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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