Autor: |
N. F. Lukina, A.P. Petrova, A. Yu. Isaev, K.L. Besednov |
Rok vydání: |
2021 |
Předmět: |
|
Zdroj: |
Proceedings of VIAM. :44-54 |
ISSN: |
2307-6046 |
Popis: |
The influence of the chemical nature and component composition of the polymer base and the curing conditions of conductive adhesive compositions on their conductive properties is shown. The values of the volumetric shrinkage during the curing of the adhesive are compared with the realized level of conductive properties. The influence of the temperature level during curing on the electrical conductivity of the cured glue is shown. Shrinkage phenomena, viscosity, temperature range of the curing reaction were investigated as factors determining the appearance and formation of the conductive properties of conductive compositions during curing. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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