RF/wireless interconnect for inter- and intra-chip communications
| Autor: | Liyang Zhang, Hyunchol Shin, M.-C.F. Chang, Vwani P. Roychowdhury, Yongxi Qian |
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| Rok vydání: | 2001 |
| Předmět: |
Capacitive coupling
Interconnection Engineering business.industry Electrical engineering Control reconfiguration Fault tolerance Integrated circuit Interconnect bottleneck Chip law.invention law Hardware_INTEGRATEDCIRCUITS Electronic engineering Signal integrity Electrical and Electronic Engineering business |
| Zdroj: | Proceedings of the IEEE. 89:456-466 |
| ISSN: | 0018-9219 |
| Popis: | Recent studies showed that conventional approaches being used to solve problems imposed by hard-wired metal interconnects will eventually encounter fundamental limits and may impede the advance of future ultralarge-scale integrated circuits (ULSls). To surpass these fundamental limits, we introduce a novel RF/wireless interconnect concept for future inter- and intra-ULSI communications. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on low loss and dispersion-free microwave signal transmission, near-field capacitive coupling, and modem multiple-access algorithms. In this paper we address issues relevant to the signal channeling of the RF/wireless interconnect and discuss its advantages in speed, signal integrity, and channel reconfiguration. The electronic overhead required in the RF/wireless-interconnect system and its compatibility with the future ULSI and MCM (multi-chip-module) will be discussed as well. |
| Databáze: | OpenAIRE |
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