Transient liquid phase bonding of Sn-Pb solder with added Ni particles

Autor:	Jiaxing Wang, Quanbin Yao, Pengrong Lin, Yingzhuo Huang, Xiaochen Xie, Zhi Zhang
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
DOI:	10.1109/icept56209.2022.9873278
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4c9dd92d6d6ea47b58155ef199b9e2ac https://doi.org/10.1109/icept56209.2022.9873278 Zobrazit plný text záznamu