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A detailed study carried out on the present and future solid-state semiconductor technologies for Transmit/Receive or Transceiver module (T/R-Module) design and development. The implementation of T/R-Module involves problem selection, study on different architectures, performance parameters, modeling and analysis challenges. In this paper, we examine several T/R-Module architectures/topologies, analyze their performance, present tradeoff between different performance parameters, and recommend architecture for a given set of requirements. A detailed methodology and step-by-step procedure presented for developing T/R-Modules, based on commercially-of the-shelf (COTS) implementation for X-band and Ku-band applications. The work is further extended to modeling and analysis of the T/R-Modules using NI/AWR Visual System Simulator (VSS) a complex envelope system simulator. The first section of this paper introduces T/R-Module concepts and present technologies. Then in following sections on Solid-State Semiconductor technologies for the implementation of T/R-Modules. Modeling and analysis of T/R-Module performance parameters for different architectures and studying the tradeoffs. |
