Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Transfer Lamination Method
| Autor: | Toku Yoshino, Satoshi Ishiguro, Nakayama Hajime, Tatsuo Wada, Naoki Fukutomi, Yoshiaki Tsubomatsu |
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| Rok vydání: | 1994 |
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| Zdroj: | Circuit Technology. 9:369-376 |
| ISSN: | 1884-118X 0914-8299 |
| Databáze: | OpenAIRE |
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