Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors
| Autor: | Sumeet S. Kumar, Amir Zjajo, Rene van Leuken |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Engineering Electronic system-level design and verification Multi-core processor business.industry 02 engineering and technology Integrated circuit 01 natural sciences 020202 computer hardware & architecture law.invention Thermal aware Hardware and Architecture law Embedded system 0103 physical sciences Dark silicon 0202 electrical engineering electronic engineering information engineering Systems design Electrical and Electronic Engineering business Software |
| Zdroj: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 25:1549-1562 |
| ISSN: | 1557-9999 1063-8210 |
| DOI: | 10.1109/tvlsi.2016.2642587 |
| Popis: | This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks, spanning architectural techniques, design methodologies, and runtime temperature management. Importantly, this paper provides novel insights into the causes of hotspot formation in 3-D ICs and details a practical approach toward exploring and mitigating performance-limiting thermal behavior early in the system design flow. |
| Databáze: | OpenAIRE |
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