Effect of Aluminum Clad Cu Wire Bonds on Power Cycle Lifetime for High Current Density Power Module Packages
| Autor: | Fumiyoshi KAWASHIRO, Masaaki YOSHIKAWA, Eitaro MIYAKE, Yoshiki ENDO, Tatsuo TONEDACHI, Hiroshi NISHIKAWA |
|---|---|
| Rok vydání: | 2022 |
| Zdroj: | Journal of Smart Processing. 11:71-77 |
| ISSN: | 2187-1337 2186-702X |
| DOI: | 10.7791/jspmee.11.71 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|