Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid Bonding
Autor: | Shunsuke Furuse, Nobutoshi Fujii, Kengo Kotoo, Naoki Ogawa, Suguru Saito, Taichi Yamada, Takaaki Hirano, Yoshiya Hagimoto, Hayato Iwamoto |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
Databáze: | OpenAIRE |
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