Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film
Autor: | Hideyuki Amada, Fumiaki Kumasaka, Naoki Awaji, Yoshihiko Imanaka |
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Rok vydání: | 2016 |
Předmět: | |
Zdroj: | Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000153-000158 |
ISSN: | 2380-4491 |
DOI: | 10.4071/2016cicmt-wp31 |
Databáze: | OpenAIRE |
Externí odkaz: |