Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick Film

Autor: Hideyuki Amada, Fumiaki Kumasaka, Naoki Awaji, Yoshihiko Imanaka
Rok vydání: 2016
Předmět:
Zdroj: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000153-000158
ISSN: 2380-4491
DOI: 10.4071/2016cicmt-wp31
Databáze: OpenAIRE