Light-beam soldering of a lead free alloy

Autor:	Rafael Colás, Victor Paramo, Maribel de la Garza Garza, L. Arturo Reyes, D.I. Martínez
Rok vydání:	2010
Předmět:	musculoskeletal diseases Materials science Tension (physics) Metallurgy Alloy Intermetallic engineering.material Soldering engineering Light beam General Materials Science Bearing capacity Composite material Lead (electronics) Layer (electronics)
Zdroj:	International Journal of Microstructure and Materials Properties. 5:491
ISSN:	1741-8429 1741-8410
Popis:	Light-beam joints made from a Sn-Ag-Cu lead free solder alloy were studied. Joints were prepared with the five combinations of variables that resulted with the least amount of defects; these joints were tested in tension to evaluate their load bearing capacity. Solder pads made following these conditions were aged to study the growth of the intermetallic compound layer and its effect on the resistance of the joints. It was found that aging engrosses this layer and that the bearing capacity increased until the layer reaches 1.5 µm; further thickening reduces the resistance of the joints.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4b48bdcdda69e1595dbc0382bf0f8d11 https://doi.org/10.1504/ijmmp.2010.038150 Zobrazit plný text záznamu