Reliability of stack packaging varying the die stacking architectures for flash memory applications

Autor:	S. Pekin, Terry Dishongh, R. Akhter, M.M. Hossain, Dereje Agonafer, Yongje Lee
Rok vydání:	2006
Předmět:	Materials science Reliability (semiconductor) Stack (abstract data type) Chip-scale package Flash (manufacturing) Stacking Electronic engineering Mechanical engineering Integrated circuit packaging Die (integrated circuit) Flash memory
Zdroj:	Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.
DOI:	10.1109/stherm.2006.1625232
Popis:	Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant for stack die configuration and leads to study the effect of combined thermo-mechanical and mechanical stresses. As there are existence of multiple die and other material with different CTEs, thermo-mechanical loading and its effect on reliability needs to be studied for optimum package design and die configuration
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4a9c33c56a86fa402903c858dc3e2fd0 https://doi.org/10.1109/stherm.2006.1625232 Zobrazit plný text záznamu