Determination of the temperature coefficient of linear expansion by processing of the interferograms

Autor:	R. N. Sergeev, M.N. Osipov
Rok vydání:	2018
Předmět:	History Materials science Mathematical analysis Astrophysics::Instrumentation and Methods for Astrophysics Holography Bending Sample (graphics) Thermal expansion Computer Science Applications Education law.invention Interferometry Thermoelastic damping law Speckle imaging Temperature coefficient
Zdroj:	Journal of Physics: Conference Series. 1096:012101
ISSN:	1742-6596 1742-6588
DOI:	10.1088/1742-6596/1096/1/012101
Popis:	In this paper the theoretical and experimental justification of the simple high-precision method of determining the temperature coefficient of linear expansion of the holographic or digital speckle interferometry are presented. The interferogram is proposed to register under bending thermoelastic deformations of the sample caused by the temperature difference through thickness. The proposed method is contactless and does not impose special requirements to the surface material as in the case of classical interferometry. Is numerical modelling of thermoelastic deformations of the sample, confirming the correctness of the proposed method.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4a7f209a4cab1d0d4312f19f743b6120 https://doi.org/10.1088/1742-6596/1096/1/012101 Zobrazit plný text záznamu