Board level validation for green IC packaging with strain-controllable dynamic bending method

Autor:	null Jeffrey ChangBing Lee, null Chi-Ko Yu, null Graver Chang, null Tina Shao, null Cherie Chen, null Xiang-Kai.Meng, Matt Brown
Rok vydání:	2010
Předmět:	Printed circuit board Reliability (semiconductor) Materials science Electrical resistance and conductance Soldering Mechanical engineering Integrated circuit packaging Electronics Bending Composite material Lead (electronics)
Zdroj:	2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Popis:	In the study, instead of electrical resistance monitoring in JEDEC JESD22–B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4a54c67882ef4099f2de2d6a5bb9ea91 https://doi.org/10.1109/icept.2010.5582354 Zobrazit plný text záznamu