Autor: |
null Jeffrey ChangBing Lee, null Chi-Ko Yu, null Graver Chang, null Tina Shao, null Cherie Chen, null Xiang-Kai.Meng, Matt Brown |
Rok vydání: |
2010 |
Předmět: |
|
Zdroj: |
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging. |
Popis: |
In the study, instead of electrical resistance monitoring in JEDEC JESD22–B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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