High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application
| Autor: | Bo Wen, Jae-Woong Nah, Russell A. Budd, Evan G. Colgan, Qianwen Chen, Li-Wen Hung, John U. Knickerbocker, Bing Dang |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Wafer-scale integration Laser ablation Interface (computing) Mechanical engineering Fan-out 02 engineering and technology 021001 nanoscience & nanotechnology Chip Laser 01 natural sciences law.invention 010309 optics law 0103 physical sciences Wafer 0210 nano-technology Wafer-level packaging |
| Zdroj: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). |
| Popis: | This paper proposed a high-speed precision handling technology of micro-chip using programmable laser debonding technology for fan-out wafer level packaging (FOWLP) application, and investigated the programmable capability, the speed and the accuracy with laser debonding experiments on chips down to 25umX25um. The proposed FOWLP approach has features of: (a) all steps are based on wafer-level processes by using programmable laser debonding technology to achieve the reconstituted wafer, enabling high-speed precision hanldinghandling technology for micro-chip. And, (b) two bonding interface layers, one high-strength adhesive layer for chips firmly joined to handler and the other UV-sensitive layer for easily laser debonding, can improve the die-shift issues. The successfully debonding results, including selectively debonding 200umX400um chips from handler wafer and specifically debonding 25umX25um chips forming the letters "IBM", indicates the programmable capability of this technology. The experiment results show that the debonding speed can be up to 360,000 components per hour (cph), and the debonding accuracy can be in the microns range. |
| Databáze: | OpenAIRE |
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