| Autor: |
Yu-Chih Wang, Wenli Collison, Frank Robertson, Paul Farrar, Christopher L. Borst, K. K. W. Lee, Rand Cottle, Greg Akiki, Mark Kelling, Wen-Yu Ku, Lin Pinyen, Sangdong Kwon, David Skilbred, John Lin, Stock Chang |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
2013 IEEE International Electron Devices Meeting. |
| DOI: |
10.1109/iedm.2013.6724626 |
| Popis: |
A close collaboration among IC makers, equipment and material suppliers, facility, and automation providers resulted in better alignment in the technology roadmap and lower development costs for tools and wafers. This would enable the cost-effective operation of future 450mm HVM fabs. The 450mm transition will certainly create another prosperous opportunity for the semiconductor industry. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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