Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder

Autor:	D.C. Lin, Guo-Xiang Wang, Meslet Al-Hajri, M. Petraroli, Tirumalai S. Srivatsan
Rok vydání:	2003
Předmět:	Materials science Mechanical Engineering Metallurgy Solder paste Condensed Matter Physics Microstructure Indentation hardness Titanium oxide chemistry.chemical_compound chemistry Mechanics of Materials Soldering Titanium dioxide General Materials Science Grain boundary Eutectic system
Zdroj:	Materials Letters. 57:3193-3198
ISSN:	0167-577X
DOI:	10.1016/s0167-577x(03)00023-5
Popis:	This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of titanium dioxide to a conventional solder. Titanium dioxide powders-reinforced lead (Pb)–tin (Sn) composite solders were prepared by thoroughly blending nano-sized titanium dioxide powders with powders of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed that for additions of titanium dioxide up to 1 wt.%, the grain size and width of the grain boundary decreased. For the addition of 2 wt.% of titanium dioxide, nanopowders microporosity was observed both at and along the grain boundary regions coupled with the presence of second-phase particles. Microhardness measurements revealed that the addition of titanium dioxide nanopowders is helpful in enhancing the overall strength of the eutectic solder.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4a1864422376dcdaf4e320fc7de7df7d https://doi.org/10.1016/s0167-577x(03)00023-5 Zobrazit plný text záznamu Full Text from ScienceDirect