Ultra-fine SAC305 Solder Paste Interconnection Solution for Advanced Packaging

Autor:	Lim Chze Min Jason, B. Senthil Kumar, Kang Sungsig, Yam Lip Huei, Zhang Rui Fen, Sarangapani Murali
Rok vydání:	2022
Zdroj:	2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
DOI:	10.1109/iemt55343.2022.9969513
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4a0fd378930b601c368fb2fa66ba3782 https://doi.org/10.1109/iemt55343.2022.9969513 Zobrazit plný text záznamu