Simultaneous Fabrication of n & p Contacts for Bifacial Cells by a Novel Co-Plating Process
| Autor: | Russell, R., Tous, L., Cornagliotti, E., Hendrickx, D., Duerinckx, F., Szlufcik, J. |
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| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: | |
| DOI: | 10.4229/eupvsec20172017-2bp.1.3 |
| Popis: | 33rd European Photovoltaic Solar Energy Conference and Exhibition; 212-217 This paper describes a n & p surface Ni/Ag co-plating process for the metallization of bifacial cells suitable for multi-wire module integration. The process, based on electroless Ni and immersion Ag plating, mitigates typical problems of achieving simultaneous electroless Ni plating onto n & p surfaces by the use of a novel silicon selective activation step. Key attractive features of this metallization process include low cost from low Ag usage (typically < 8 mg/cell) and low stress batch processing with no cell contacting using low Capex high throughput tools. The plating process is applied to metallize bifacial nPERT+ cells achieving average cell efficiencies of 22.4% with typical cell bifacialities above 95%. Limited 1 cell laminate reliability data is given with IEC61215 thermal cycling and damp heat test criteria being met. Finally we present cost-of-ownership estimates at the cell level ($/cell), module level ($/Wp) and system level LCOE ($/kWh) for multi-wire modules made from nPERT+ cells using the co-plating process and compare the results to conventional modules with screen printed pPERC+ cells. Reductions in the LCOE of ≥ 5% are estimated for co-plated nPERT+ cell multi-wire modules for albedo values ≥10%. |
| Databáze: | OpenAIRE |
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