Dependence of the fused-silica etch rate on the etch mask opening diameter
| Autor: | Christoph Doering, Henning Fouckhardt, Christina Kimmle, Sandra Wolff |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
Fabrication
Materials science business.industry fungi Isotropy technology industry and agriculture macromolecular substances Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Optics stomatognathic system Etch pit density Optoelectronics SPHERES Electrical and Electronic Engineering business Lithography Groove (music) |
| Zdroj: | Microelectronic Engineering. 112:10-13 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2013.05.006 |
| Popis: | Display Omitted Combination of thin hard and soft lithographic mask.Deep etched half spherical profiles in fused silica.Realization of different etch depth in only one etch step.Realization of a microscopic twin iris array module. We report on a technology to reach different etch depths in fused silica simultaneously by using different diameters of the openings in the etch mask. Usually, the etch rate is determined by the etch solution, the temperature, and the concentration of the etch solution as well as the material to be etched. We show that the etch rate will also depend on the diameter of the opening in the etch mask, if the diameter is |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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