New hybrid low-k dielectric materials prepared by vinylsilane polymerization

Autor:	Jung-Won Kang, Myung-Sun Moon, Gwi-Gwon Kang, Byung Ro Kim, Min-Jin Ko, Bum-Gyu Choi
Rok vydání:	2004
Předmět:	chemistry.chemical_compound Fracture toughness Materials science chemistry Polymerization Polymer chemistry Low-k dielectric Wafer Dielectric Composite material Hybrid material Vinylsilane Curing (chemistry)
Zdroj:	MRS Proceedings. 812
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-812-f3.6
Popis:	Spin-on Low-K materials are potentially very attractive as interconnection materials in a wide range of semiconductor structures. In this work, new organic-inorganic hybrid materials synthesized by vinylsilane polymerization were proposed. According to compositions and additional fabrications, dielectric constants of these materials were evaluated to be 2.3∼3.1. The hardness was 2.0GPa after 430°C curing. These materials had good adhesion strength such that fracture toughness on silicon wafer was 0.22 MPam0.5 without any adhesion promoters. This result indicates that these organicinorganic hybrid materials are very promising candidates for low-K dielectrics.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4981f66015044cdb8fe5dbe43d8b7d98 https://doi.org/10.1557/proc-812-f3.6 Zobrazit plný text záznamu Full text from SpringerLink