Performance Improvement of Atomic Layer-Deposited ZnO/Al2O3Thin-Film Transistors by Low-Temperature Annealing in Air

Autor: Hong-Liang Lu, Li-Li Zheng, Shi-Jin Ding, You-Hang Wang, Wen-Jun Liu, David Wei Zhang, Qian Ma
Rok vydání: 2016
Předmět:
Zdroj: IEEE Transactions on Electron Devices. 63:1893-1898
ISSN: 1557-9646
0018-9383
DOI: 10.1109/ted.2016.2540679
Popis: High-performance thin-film transistors (TFTs) with atomic layer-deposited (ALD) ZnO channel/Al2O3 dielectric were fabricated under a maximum processing temperature of 200 °C. The effects of postannealing temperature and time on the performance of the TFT were investigated. Under annealing at 200 °C in air, the performance of the TFT was greatly improved by increasing the annealing time to 120 min, showing a very low OFF-current of $2.98\times 10^{-13}$ A, a small subthreshold swing (SS) of 244 mV/decade, a quite large $I_{\mathrm{\scriptscriptstyle ON}}/I_{{\mathrm{\scriptscriptstyle OFF}}}$ ratio of $4\times 10^{8}$ , and a high field-effect electron mobility of 21.9 cm2/ $\textrm {V}\cdot \textrm {s}$ . Furthermore, good electrical stabilities were also demonstrated under gate-bias stress, such as a threshold voltage shift ( $\Delta V_{\textrm {th}}$ ) of −1.1 V and a $\Delta $ SS of 86 mV/decade under −20 V for 3000 s, a $\Delta V_{\textrm {th}}$ of 0.29 V, and a $\Delta $ SS of −44 mV/decade under +20 V for 3000 s. The above results are attributed to the gradual passivation of oxygen vacancies in the ZnO channel and interface traps at the interface of ZnO/Al2O3 with an increment of annealing time. Thus, the current ZnO TFT with a low thermal budget and high performance is very promising for flexible electronic applications.
Databáze: OpenAIRE