Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

Autor: Jong-Woong Kim, Jin-Kyu Jang, Jeong-Won Yoon, Byung-Woo Kim, Seung-Boo Jung, Sun-Kyu Park, Sang-Su Ha, Sang-Ok Ha
Rok vydání: 2009
Předmět:
Zdroj: Journal of Electronic Materials. 38:2489-2495
ISSN: 1543-186X
0361-5235
DOI: 10.1007/s11664-009-0916-y
Popis: The traditional ball shear test is not suitable for evaluating joint reliability under drop loading, since the applied test speeds, usually lower than 5 mm/s, are well below the impact velocity applied to the solder joint in a drop test. The present study expands recently reported research by investigating the effect of thermal aging on the joint strength and fracture mode of Sn-3.0Ag-0.5Cu ball grid arrays during high-speed shear testing, with a shear height of 50 μm and a shear speed ranging from 0.01 m/s to 3 m/s. The test specimens were aged at 393 K for 1000 h. After reflow, a (Ni,Cu)3Sn4 intermetallic compound (IMC) layer was observed at the solder/Ni-P interface and the thickness of the IMC layer was increased through the aging process. The shear strength increased with increasing shear speed. The fracture surface of the solder joints showed three different fracture modes according to the shear speed and aging time. The fracture mode changed from ductile fracture to brittle fracture with increasing shear speed.
Databáze: OpenAIRE
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