Additive Fine-Line Circuit Process through Catalyst Induced Copper Electroless Plating

Autor:	Wan-Ying Lin, Jen-Yuan Chang, Hung-Yi Lin, Ta-Hsin Chou, Lei-Yi Chen, Yi-Wei Lin, Da-Jeng Yao, Yu-Ming Wang, Ying-Fang Chang, Chien-Hung Lien
Rok vydání:	2020
Předmět:	Materials science chemistry Electroless plating Scientific method Metallurgy chemistry.chemical_element Fine line Copper Catalysis
Zdroj:	Journal of Mechanics Engineering and Automation. 10
ISSN:	2159-5283 2159-5275
DOI:	10.17265/2159-5275/2020.01.002
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4910f7af47a26218dbbc5a6236638d91 https://doi.org/10.17265/2159-5275/2020.01.002 Zobrazit plný text záznamu