Study of Pyrazole as Copper Corrosion Inhibitor in Alkaline Post Chemical Mechanical Polishing Cleaning Solution

Autor:	Tamal Mukherjee, Arindom Goswami, Simon Koskey, Oliver Chyan
Rok vydání:	2014
Předmět:	Materials science Benzotriazole Inorganic chemistry chemistry.chemical_element Pyrazole Copper Electronic Optical and Magnetic Materials Corrosion Corrosion inhibitor chemistry.chemical_compound Ammonium hydroxide chemistry Chemical-mechanical planarization Erosion corrosion of copper water tubes
Zdroj:	ECS Journal of Solid State Science and Technology. 3:P293-P297
ISSN:	2162-8777 2162-8769
Popis:	In microelectronics fabrication, post chemical mechanical polishing (CMP) cleaning is required to remove organic contaminants and particles left on copper interconnects after the CMP process. Use of cleaning solutions, however, causes serious reliability issues due to corrosion and recession of the interconnects. In this study, Pyrazole is demonstrated to be a potentially superior Cu corrosion inhibitor for tetramethyl ammonium hydroxide (TMAH)-based post CMP cleaning solutions at pH 14. Micropattern corrosion screening results and electrochemical impedance spectroscopy (EIS) revealed that 1 mM Pyrazole in 8 wt% TMAH solution inhibits Cu corrosion more effectively than 10 mM benzotriazole (BTA) under same conditions. Moreover, water contact angle measurement results also showed that Pyrazole-treated Cu surfaces are relatively hydrophilic compared to those treated with BTA/TMAH. X-ray photoelectron spectroscopy (XPS) analysis supports Cu-Pyrazole complex formation on the Cu surface. Overall Cu corrosion rate in TMAH-based highly alkaline post CMP cleaning solution is shown to be considerably reduced to less than 1A/min by addition of 1 mM Pyrazole.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::490c2631f5dbfd5cce8a467f28410fdd https://doi.org/10.1149/2.0011410jss Zobrazit plný text záznamu