An interactive and integrated thermal characterization of component placement on a printed circuit board

Autor:	Sophie Louage, Jean-Louis Blanchard
Rok vydání:	1997
Předmět:	Engineering drawing Engineering business.industry General Engineering Usability Floorplan Printed circuit board Superposition principle Component (UML) Hardware_INTEGRATEDCIRCUITS Electronic engineering Representation (mathematics) business Component placement Fourier series
Zdroj:	Microelectronics Journal. 28:209-219
ISSN:	0026-2692
DOI:	10.1016/s0026-2692(96)00025-0
Popis:	This article deals with a tool integrated in a floorplanning environment for the fast thermal characterization of the component placement on a printed circuit board. The algorithm based on Fourier series expansion and on the superposition principle is designed to outline interactively the impact of a new placement on the board hot spots. The ease of use is reinforced by a heat transfer coefficient advisor assisting the user in the specification of boundary conditions. A discussion of the tool accuracy based on comparisons with experimental measurements is included, in order to outline the role played by the modelling of operating conditions and by the component representation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::48fb05451820ce622b5524a3053b429b https://doi.org/10.1016/s0026-2692(96)00025-0 Zobrazit plný text záznamu Full Text from ScienceDirect