Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings
| Autor: | J. Paz, Rob N. Candler, Omeed Paydar, N.B. Shah, C.N. Paredes, Yongha Hwang |
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| Rok vydání: | 2014 |
| Předmět: |
Interconnection
Packaging engineering Computer science business.industry Gasket Interface (computing) Microfluidics Metals and Alloys 3D printing Nanotechnology Modular design Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Characterization (materials science) Electrical and Electronic Engineering business Instrumentation |
| Zdroj: | Sensors and Actuators A: Physical. 205:199-203 |
| ISSN: | 0924-4247 |
| Popis: | Lab-on-a-chip (LOC) devices have enabled significant advancements in medical, biological, and chemical analysis. However, widespread adoption of these devices in, clinical settings and academic environments has been impeded by a lack of a reliable, adaptable, and easy-to-use packaging technology. In this work, we introduce a rapid, prototyped modular microfluidic interconnect that addresses these challenges of the, world-to-chip interface. The interconnect, a flexible polymer gasket co-printed with, rigid clamps, eliminates adhesives and additional assembly by direct multi-material 3D, printing from a computer-aided design model. The device represents the first, application of multi-material 3D printing to microfluidic interconnects, and it can be, rapidly re-designed and printed, and has demonstrated the ability to withstand, pressures exceeding 400 kPa. |
| Databáze: | OpenAIRE |
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