Advanced Inspection Technique for High Aspect Ratio Contact Holes Using e Beam Scan and Voltage Cap in SEM Review

Autor:	Ling-Wu Yang, Chih-Yuan Lu, Tahone Yang, Kuang-Chao Chen, Hsiang-Chou Liao, Tuung Luoh, Che-Lun Hung
Rok vydání:	2012
Předmět:	Engineering Optics business.industry Electron beam processing business Voltage
Zdroj:	ECS Transactions. 44:1207-1212
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3694449
Popis:	The inspection strategy and technique of high aspect ratio contact modules are demonstrated in this paper. Pre-scan with dark or bright field inspection then reviewing by Vcap condition at contact opening layer is to confirm the HAR contact patterning performance. e beam inspection with feasible conditions right after plug CMP is to monitor the whole contact module and the plugs fill-in performance.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::48b106908c5fec2311f5e5d0bbb65049 https://doi.org/10.1149/1.3694449 Zobrazit plný text záznamu