A Novel Array-Based Test Methodology for Local Process Variation Monitoring
| Autor: | Samuel C. Pan, Michael Shien-Yang Wu, Mango C.-T. Chao, Tseng-Chin Luo, Chin. C. Hsia, Chuen-Uan Huang, Huan-Chi Tseng, Philip A. Fisher, Kuo-Tsai Li, Yuan-Yao Chang, Konrad K.-L. Young |
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| Rok vydání: | 2011 |
| Předmět: |
Engineering
business.industry Process (computing) Transistor array Test method Condensed Matter Physics Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Compensation (engineering) Process variation Automatic test equipment Electronic engineering Overhead (computing) Electrical and Electronic Engineering business Voltage |
| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. 24:280-293 |
| ISSN: | 1558-2345 0894-6507 |
| DOI: | 10.1109/tsm.2010.2095891 |
| Popis: | As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for integrated circuit manufacturing. To monitor local process variation, a large number of devices-under-test (DUTs) in close proximity must be measured. In this paper, we present a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by application of the test techniques proposed in this paper: hardware IR compensation, voltage bias elevation, and leakage-current cancelation. Furthermore, the DUT layout need not be modified for the proposed test structure. Thus, the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation. |
| Databáze: | OpenAIRE |
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