QFP/quartz Adhesive Bonding with Surface Treatment for Physical Security of Edge Artificial Intelligence Devices

Autor:	Hiro Nodaka, Ami Tezuka, Hiroyuki Kuwae, Kosuke Yamada, Morihisa Hoga, Shuichi Shoji, Jun Mizuno, Haruo Shimamoto
Rok vydání:	2020
Předmět:	Surface (mathematics) Materials science Adhesive bonding Atmospheric-pressure plasma Edge (geometry) Composite material Quartz Physical security
Zdroj:	Transactions of The Japan Institute of Electronics Packaging. 13:E20-008
ISSN:	1884-8028 1883-3365
DOI:	10.5104/jiepeng.13.e20-008-1
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::48a135ee140b29ce0d8445f2571b7e4d https://doi.org/10.5104/jiepeng.13.e20-008-1 Zobrazit plný text záznamu