Substrate aware OPC rules for edge effect in block levels
| Autor: | Irene Popova, Ian Stobert, Todd Bailey, Dongbing Shao, Chan Sam Chang |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Engineering
Engineering drawing business.industry Computational lithography Hardware_PERFORMANCEANDRELIABILITY Substrate (printing) law.invention Resist Optical proximity correction law Hardware_INTEGRATEDCIRCUITS Electronic engineering Node (circuits) Photolithography business Lithography Block (data storage) |
| Zdroj: | SPIE Proceedings. |
| ISSN: | 0277-786X |
| DOI: | 10.1117/12.865134 |
| Popis: | Implant level photolithography processes are becoming more challenging each node due to everdecreasing CD and resist edge placement requirements, and the technical challenge is exacerbated by the business need to develop and maintain low-cost processes. Optical Proximity Correction (OPC) using models created based on data from plain silicon substrate is not able to accommodate the various real device/design scenarios due to substrate pattern effects. In this paper, we show our systematic study on substrate effect (RX/STI) on implant level lithography CD printing. We also explain the CD variation mechanism and validate by simulation using well calibrated physical resist model. Based on the results, we propose an approach to generate substrate-aware OPC rules to correct for such substrate effects. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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