Characterization Methods of Subsurface Cracks in Grinding of Optical Elements

Autor:	Chu Wang, Shunzhi Feng, Hongxiang Wang, Benwen Zhu, Rui Gao
Rok vydání:	2017
Předmět:	0209 industrial biotechnology Materials science Abrasive Mineralogy Polishing 02 engineering and technology 021001 nanoscience & nanotechnology Grain size Grinding 020901 industrial engineering & automation Characterization methods Maximum depth Cluster (physics) 0210 nano-technology
Zdroj:	IOP Conference Series: Materials Science and Engineering. 250:012025
ISSN:	1757-899X 1757-8981
DOI:	10.1088/1757-899x/250/1/012025
Popis:	In this paper, the subsurface cracks of fused silica introduced in grinding were detected by taper polishing method, and then characterized by the maximum depth, the cluster depth, and the density of cracks. The quantitative relationship between maximum depth and cluster depth of subsurface cracks was determined, and the distribution of subsurface crack density along the depth was studied. The results showed that the abrasive grain size had a great influence on maximum depth and cluster depth of subsurface cracks, while the grinding fluid concentration had little effect on them. The different processing parameters changed maximum depth and cluster depth, but their ratio was almost unchanged. The subsurface crack density decreased exponentially along the depth, and the decrease trend had slowed down significantly at the half of cluster depth.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4873321af5de8af6449b4f08c9a50f3d https://doi.org/10.1088/1757-899x/250/1/012025 Zobrazit plný text záznamu