Effect of SiC crystal orientation on Ti3SiC2formation between SiC and Al/Ti bi-layered film

Autor: Masato Tsutaoka, Yasuo Takahashi, Masakatsu Maeda
Rok vydání: 2021
Předmět:
Zdroj: Ceramics International. 47:7753-7763
ISSN: 0272-8842
DOI: 10.1016/j.ceramint.2020.11.120
Popis: The present study was performed to understand the interfacial reaction between Al/Ti bi-layered films and 4H–SiC with various surface orientations and the preferential growth orientation of Ti3SiC2 crystals. To this end, n-type 4H–SiC crystals oriented to the (0001), (1 1 ‾ 00), and (11 2 ‾ 0) surfaces were prepared. The (0001) and (11 2 ‾ 0) surfaces of the p-type 4H–SiC were composed of commercially available p-type 4H–SiC wafers; these surfaces were tilted by 8° from (0001) towards [11 2 ‾ 0] by the dicing and polishing of the wafers. Using the same method, another surface orientation was achieved wherein the surface was tilted by 30° from (11 2 ‾ 0) towards [0001]. Further, Al/Ti bi-layered films were deposited on each SiC substrate, using the radio-frequency magnetron sputtering method, which was followed by the stepwise annealing. The microstructures were examined by X-ray diffractometry and transmission electron microscopy. The Ti3SiC2 phase grew epitaxially in the [11 2 ‾ 0]SiC orientation on the (0001) surface of 4H–SiC. Ti3SiC2 phase did not grow uniformly on the other SiC surfaces that were oriented to (1 1 ‾ 00) or (11 2 ‾ 0). The Ti3SiC2 phase growth was columnar and parallel to (0001)SiC in the [11 2 ‾ 0]SiC orientation on the SiC surface tilted by 30° from (11 2 ‾ 0) towards [0001]. The electrical characteristics of p-type 4H–SiC contact films measured before and after annealing revealed that the characteristics of Al/Ti/(11 2 ‾ 0)4H–SiC were improved after annealing.
Databáze: OpenAIRE