High resolution e-beam lithography using a thin titanium layer to promote resist adhesion
| Autor: | Andrew Glidle, X. Cao, John M. R. Weaver, Stephen Thoms, I. Young, Douglas Macintyre |
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| Rok vydání: | 2006 |
| Předmět: |
Materials science
Extreme ultraviolet lithography Nanotechnology Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Resist law X-ray lithography Electrical and Electronic Engineering Thin film Photolithography Lithography Next-generation lithography Electron-beam lithography |
| Zdroj: | Microelectronic Engineering. 83:1128-1131 |
| ISSN: | 0167-9317 |
| Popis: | This paper describes improvements in high resolution large area e-beam lithography when a thin titanium layer is applied to substrates prior to the application of resist. The technique is particularly useful when there is a requirement to pattern long unsupported nanostructures such as lines which are more than a millimetre long but have widths of less than 20nm. Such feature sizes are now readily achieved using the most advanced e-beam lithography tools which can have patterning writing fields in excess of one millimetre and spot sizes of less than 5nm. In this paper, we describe a simple technique to improve the adhesion of different resist structures, particularly on III-V materials to enable the rapid evaluation of high resolution e-beam lithography and we show that X-ray photoelectron spectroscopy (XPS) can be useful in understanding substrate-resist interactions. |
| Databáze: | OpenAIRE |
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