Technologies Behind the Smart Grid and Internet of Things: A System Survey

Autor:	Kuldeep Sharma, Arun Malik, Isha Batra, A. S. M. Sanwar Hosen, Md Abdul Latif Sarker, Dong Seog Han
Rok vydání:	2023
Předmět:	Biomaterials Mechanics of Materials Modeling and Simulation Electrical and Electronic Engineering Computer Science Applications
Zdroj:	Computers, Materials & Continua. 75:5049-5072
ISSN:	1546-2226
DOI:	10.32604/cmc.2023.035638
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::47922ddcefd3bf9a5917113cd4cc2050 https://doi.org/10.32604/cmc.2023.035638 Zobrazit plný text záznamu