Failure mechanism of Ag-4Pd alloy wire bonded on Al-Si metallization under high temperature storage and thermal cycle tests in corrosive environments
| Autor: | Fan-Yi Ouyang, Jui-Nung Wang, Yan-Wen Tsau |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Alloy Metallurgy Intermetallic chemistry.chemical_element Failure mechanism 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Corrosion Galvanic corrosion chemistry 0103 physical sciences Chlorine engineering General Materials Science 0210 nano-technology Layer (electronics) High temperature storage |
| Zdroj: | Materials Chemistry and Physics. 218:147-153 |
| ISSN: | 0254-0584 |
| DOI: | 10.1016/j.matchemphys.2018.07.021 |
| Popis: | This study investigated the failure mechanism of Ag-4Pd wire bonded on Al metallization under chlorine corrosive environments after high temperature storage tests (HTST) and thermal cycle tests (TCT). Results show that as-bonded samples encountered the fastest failure, caused by corrosion of Al metallization accelerated by galvanic corrosion. For HTST samples, the intermetallic compound (IMC) layer was corroded and separated into the upper layer of Ag2Al and Ag3Al and the lower layer of Ag3Al2. The non-continuous Ag3Al2 IMC layers in TCT samples can act as a barrier to inhibit the galvanic corrosion and effectively retard the corrosion rate of Al metallization. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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