(Invited) Silicon Compatible High Performance Optical Interconnect Technology

Autor:	Birendra Raj Dutt
Rok vydání:	2013
Předmět:	Materials science Silicon chemistry business.industry Optical interconnect Hardware_INTEGRATEDCIRCUITS Optoelectronics chemistry.chemical_element business
Zdroj:	ECS Transactions. 50:371-380
ISSN:	1938-6737 1938-5862
DOI:	10.1149/05009.0371ecst
Popis:	High speed optical interconnects provide significant performance improvement and power savings over copper-based solutions in high performance computing and data networking applications. APIC's integrated components using wavelength division multiplexing have been demonstrated for avionics networking. Extension of this technology to the chip scale enables multicore processors to be networked using optical interconnects, extending the performance and power benefits to large scale multicore processors. CMOS fabrication compatibility necessitates that the optical transmitters and receivers and other link components be silicon based, which we implement using epitaxial germanium. APIC has demonstrated both optical transmission and detector technology using germanium in silicon and is working on transitioning the fabrication process to a production foundry. Here we show recent results of germanium optical receivers and, more significantly, demonstration of strained germanium optical sources integrated in a silicon chip. The optical link is suitable for integrated chip-scale fabrication.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4738e23504356da3044598c97e435035 https://doi.org/10.1149/05009.0371ecst Zobrazit plný text záznamu