Effect of Bridging Groups of Precursors on Modulus Improvement in Plasma-Enhanced Copolymerized Low-k Films
| Autor: | Masashi Komatsu, Jun Kawahara, Keizo Kinoshita, Rie Ichikawa, Yutaka Seino, Akinori Nakano, Yoshihiro Hayashi, Nobutaka Kunimi, Takamaro Kikkawa, Yuko Takasu |
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| Rok vydání: | 2007 |
| Předmět: |
Materials science
Renewable Energy Sustainability and the Environment technology industry and agriculture Modulus Plasma Dielectric Condensed Matter Physics Mass spectrometry Plasma polymerization Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry.chemical_compound Monomer chemistry Chemical engineering Polymer chemistry Materials Chemistry Electrochemistry Copolymer Pyrolysis |
| Zdroj: | Journal of The Electrochemical Society. 154:H198 |
| ISSN: | 0013-4651 |
| DOI: | 10.1149/1.2429048 |
| Popis: | The mechanical strength of an organic silica low dielectric constant film was enhanced by introducing a reinforcement monomer into a matrix monomer under plasma polymerization deposition. The modulus improvement mechanism was investigated by using pyrolysis gas chromatography and mass spectrometry. Incorporation of a reinforcement monomer in the film matrix through copolymerization reactions was confirmed. Compositional analysis of the films showed that the extent of reinforcement was associated with the copolymerization ratio and the monomer content in the film. It is also found that the modulus enhancement depends on the content of three-dimensional aromatic bridged structure. |
| Databáze: | OpenAIRE |
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