Autor: |
Cheng-Chia Kuo, Po-Ying Chen, M.H. Jing, Shen-Li Chen, Ming-Hsiung Tsai, T.-C. Lin |
Rok vydání: |
2007 |
Předmět: |
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Zdroj: |
2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits. |
DOI: |
10.1109/ipfa.2007.4378101 |
Popis: |
This investigation considers in detail a defect called "silicon substrate damaged defects" and also introduces these defects' forming mechanisms and their root causes. These defects are likely to become increasing important in the future of deep-sub micrometer ULSI's situation. Two conditions typically result in silicon damaged defects during manufacturing processes namely: (1) watermark with carbon content and (2) the electrical charges accumulated on the silicon wafer surface. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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