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The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing. |
