Influence of Contact Resistance Deterioration of Contact Finger on Electrical Thermal Coupling Field Distribution in GIS

Autor:	Wei Yang, Xuebin Hu, Guobao Zhang, Zhengyang Wu, Hengyang Zhao, Xi Yang, Lijuan Zhu
Rok vydání:	2022
Zdroj:	2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE).
DOI:	10.1109/ichve53725.2022.9961705
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::467ae6cc2a5bad57102768792700af57 https://doi.org/10.1109/ichve53725.2022.9961705 Zobrazit plný text záznamu