Grain size dependence of 1/fnoise in Al‐Cu thin‐film interconnections

Autor:	B. I. Khizhnyak, A. J. Patrinos, E. A. Salkov, I. S. Bakshee, J. A. Schwarz
Rok vydání:	1991
Předmět:	Arrhenius equation Materials science Condensed matter physics Metallurgy General Physics and Astronomy Microstructure Electromigration Noise (electronics) Grain size symbols.namesake Vacancy defect symbols Grain boundary Thin film
Zdroj:	Journal of Applied Physics. 70:1561-1564
ISSN:	1089-7550 0021-8979
DOI:	10.1063/1.349545
Popis:	1/f noise measurements have been performed on Al‐Cu thin films, of varying grain size, which were also subjected to electromigration lifetime tests. The results indicate a strong grain size dependence of the 1/f noise magnitude in the films. Moreover there is a correlation between electromigration lifetimes and values of 1/f noise magnitude, suggesting that 1/f noise measurements could be used as a nondestructive alternative to traditional electromigration testing.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4678ff7c99652c47c1a52da5cc6166dc https://doi.org/10.1063/1.349545 Zobrazit plný text záznamu