Low-ohmic contacts by excimer laser annealing of implanted polysilicon

Autor: Q.W. Pen, C.C.G. Visser, van den Aj Berg, J. Slabbekoorn, L.K. Nanvpr
Rok vydání: 2002
Předmět:
Zdroj: 1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105).
DOI: 10.1109/icsict.1998.785811
Popis: High power excimer laser annealing is used to activate dopants implanted in polysilicon layers. Sheet resistances as low os 50 /spl Omega///spl square/ are achieved for thin polysilicon layers on oxide, and low ohmic contacts have been produced to implanted junctions elevated by a polysilicon layer. The influence of the thickness of either the poly or the underlying oxide is evaluated.
Databáze: OpenAIRE