Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)
| Autor: | Tim Xia, David Cheng, Kai-Ming Yang, Yan-Jun Fan, Puru Bruce Lin, Tzvy-Jang Tseng, John H. Lau, Winnie Lu, Cheng-Ta Ko, Chia-Yu Peng, Curry Lin, Leo Chang, Hsing Ning Liu, Eagle Lin |
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| Rok vydání: | 2021 |
| Předmět: |
Materials science
Scale (ratio) Computer Networks and Communications Mechanical engineering 02 engineering and technology Temperature cycling 021001 nanoscience & nanotechnology Chip 01 natural sciences Electronic Optical and Magnetic Materials Test (assessment) 010101 applied mathematics 0101 mathematics Electrical and Electronic Engineering 0210 nano-technology |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 18:67-80 |
| ISSN: | 1551-4897 |
| Popis: | In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a printed circuit board. For comparison purpose, the one without six-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution, and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for these two cases and correlated with the thermal cycling test results. |
| Databáze: | OpenAIRE |
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